Burn-in Test and Reliability Analyses
The Temptronic ATS 605-S thermostream system in the FICS Research SCAN Lab is used to test the reliability of electronic chips. It is used to check the robustness of our proposed hardware modules (designs) against temperature variations and the natural wear and tear or aging that can be caused by exposure to high temperature and/or high voltage. It enables aging electronic chips, though a process of delivering hot and cold air to expedite the aging process, in order to ascertain whether or not they will fail under different circumstances. The systems delivers air blasts ranging in temperatures from -20 to +225°C.